Chiriac, Victor A.: search on Z-Library

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1

A numerical study of the unsteady flow and heat transfer in a transitional confined slot jet impinging on an isothermal surface

Victor A. Chiriac, Alfonso Ortega

Journal:

International Journal of Heat and Mass Transfer

Year:

2002

Language:

english

File:

PDF, 1.06 MB

english, 2002

2

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Chiriac, Victor Adrian, Lee, Tien-Yu Tom

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.01 MB

english, 2003

3

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Chiriac, Victor Adrian, Lee, Tien-Yu Tom, Hause, Vern

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 846 KB

english, 2004

4

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A figure of merit for mobile device thermal management

Chiriac, Victor, Molloy, Steve, Anderson, Jon, Goodson, Ken

Year:

2016

Language:

english

File:

PDF, 1.17 MB

english, 2016

5

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Chiriac, Victor, Chiriac, Florea

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 189 KB

english, 2008

6

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages

Chiriac, Victor, Lee, Tom, Gauen, Kim

Year:

2005

Language:

english

File:

PDF, 250 KB

english, 2005

7

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Chiriac, Victor, Lee, Tom, Krishna, Arvind, Krishnan, Venkata, Lawrence, Rodney

Year:

2005

Language:

english

File:

PDF, 311 KB

english, 2005

8

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Yu, Youmin, Chiriac, Victor, Jiang, Yingwei, Wang, Zhijie

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 2.76 MB

english, 2015

9

Duodenoscope-associated infections: a review

Balan, Gheorghe G., Sfarti, Catalin Victor, Chiriac, Stefan Andrei, Stanciu, Carol, Trifan, Anca

Journal:

European Journal of Clinical Microbiology & Infectious Diseases

Year:

2019

Language:

english

File:

PDF, 687 KB

english, 2019

10

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Lee, Tien-Yu Tom, Chiriac, Victor A., Stout, Roger

Year:

2005

Language:

english

File:

PDF, 470 KB

english, 2005

11

Uptake of Metals from Single and Multi-Component Systems by Spirulina Platensis Biomass

Zinicovscaia, Inga, Safonov, Alexey, Tregubova, Varvara, Ilin, Victor, Cepoi, Liliana, Chiriac, Tatiana, Rudi, Ludmila, Frontasyeva, Marina V.

Journal:

Ecological Chemistry and Engineering S

Year:

2016

Language:

english

File:

PDF, 494 KB

english, 2016

12

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets

Chiriac, Victor, Rosales, Jorge L.

Year:

2005

Language:

english

File:

PDF, 1.40 MB

english, 2005

13

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Chiriac, Victor, Chiriac, Florea

Year:

2005

Language:

english

File:

PDF, 259 KB

english, 2005

14

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Comparison of 2D and 3D unsteady effects of a pair of opposed confined impinging jets

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2010

Language:

english

File:

PDF, 17.54 MB

english, 2010

15

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 2 - Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Chiriac, Victor, Chiriac, Florea

Year:

2007

Language:

english

File:

PDF, 319 KB

english, 2007

16

[ASME ASME 2002 International Mechanical Engineering Congress and Exposition - New Orleans, Louisiana, USA (November 17–22, 2002)] Heat Transfer, Volume 1 - Control of Convective Heat Transfer in a Confined Laminar Impinging Jet by Low Amplitude Forcing

Chiriac, Victor Adrian, Ortega, Alfonso

Year:

2002

Language:

english

File:

PDF, 837 KB

english, 2002

17

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Absorption refrigeration method with alternative water-ammonia solution circulation system for microelectronics cooling

Chiriac, Victor, Chiriac, Florea

Year:

2010

Language:

english

File:

PDF, 498 KB

english, 2010

18

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Numerical evaluation of 2D and 3D parallel unsteady confined dual air jets

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2008

Language:

english

File:

PDF, 2.16 MB

english, 2008

19

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Chiriac, Victor Adrian, Lee, Tien-Yu Tom, Chen, H. S.

Year:

2003

Language:

english

File:

PDF, 2.94 MB

english, 2003

20

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 2 - A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2007

Language:

english

File:

PDF, 497 KB

english, 2007

21

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Comprehensive evaluation of solder paste for assembly of PQFN packages

Yu, Youmin, Xu, Sean, Chiriac, Victor

Year:

2010

Language:

english

File:

PDF, 343 KB

english, 2010

22

THERMAL STRATEGY FOR MODELING THE WIREBONDED PBGA PACKAGES

CHIRIAC, VICTOR A., LEE, TIEN-YU TOM

Journal:

Journal of Electronics Manufacturing

Year:

1999

Language:

english

File:

PDF, 161 KB

english, 1999

23

[ASME ASME 2002 International Mechanical Engineering Congress and Exposition - New Orleans, Louisiana, USA (November 17–22, 2002)] Heat Transfer, Volume 7 - Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Chiriac, Victor Adrian, Lee, Tien-Yu Tom, Rosales, Jorge Luis

Year:

2002

Language:

english

File:

PDF, 1.04 MB

english, 2002

24

[IEEE 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application - Cairo, Egypt (2007.01.3-2007.01.6)] 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application - An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Chiriac, Florea, Chiriac, Victor

Year:

2007

Language:

english

File:

PDF, 305 KB

english, 2007

25

[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Heat Transfer, Volume 2 - The Unsteady Characteristics of a Laminar Flow and Heat Transfer of a Pair of Confined Impinging Air Jets

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2003

Language:

english

File:

PDF, 1.25 MB

english, 2003

26

Road Consolidation and Banks Protections Structures on the Romanian Danube Sector in the Iron Gates National Park

DUMITRESCU, Victor, CHIRIAC, Ioan

Journal:

Year:

2018

Language:

english

File:

PDF, 1.35 MB

english, 2018

27

IgG antibodies against immunodominant C-terminal epitopes of BP230 do not induce skin blistering in mice

Feldrihan, Vasile, Licarete, Emilia, Florea, Florina, Cristea, Victor, Popescu, Octavian, Sitaru, Cassian, Chiriac, Mircea Teodor

Journal:

Human Immunology

Year:

2014

Language:

english

File:

PDF, 3.01 MB

english, 2014

28

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Heat Transfer, Volume 3 - The Miniaturization of a Refrigeration Vapor Compression System and Application to the Cooling of High Power Microelectronics

Chiriac, Victor, Chiriac, Florin

Year:

2006

Language:

english

File:

PDF, 351 KB

english, 2006

29

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Heat transfer enhancement by low amplitude forcing in unsteady confined impinging jets

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2012

Language:

english

File:

PDF, 1.68 MB

english, 2012

30

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Impacts of solder voids on PQFN packages' thermal and mechanical performances

Chiriac, Victor A., Yu, Youmin

Year:

2010

Language:

english

File:

PDF, 798 KB

english, 2010

31

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

Chiriac, Victor Adrian

Year:

2009

Language:

english

File:

PDF, 741 KB

english, 2009

32

Mass spectra of some β-keto esters. A high resolution study

Zaharie Moldovan, Nicolae Palibroda, Victor Mercea, Gheorghe Mihǎilescu, Maria Chiriac, Mircea Vlasa

Journal:

Journal of Mass Spectrometry

Year:

1981

Language:

english

File:

PDF, 319 KB

english, 1981

33

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Novel energy recovery systems for the efficient cooling of data centers using absorption chillers and renewable energy resources

Chiriac, Victor Adrian, Chiriac, Florea

Year:

2012

Language:

english

File:

PDF, 777 KB

english, 2012

34

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Phelan, Patrick E., Chiriac, Victor, Lee, Tien-Yu Tom

Year:

2003

Language:

english

File:

PDF, 225 KB

english, 2003

35

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Chiriac, Victor Adrian, Rosales, Jorge Luis

Year:

2011

Language:

english

File:

PDF, 1.27 MB

english, 2011

36

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Transient thermal performance optimization for an automotive wireless application

Chiriac, Victor

Year:

2008

Language:

english

File:

PDF, 641 KB

english, 2008

37

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An overview and comparison of various refrigeration methods for microelectronics cooling

Chiriac, Victor, Chiriac, Florea

Year:

2008

Language:

english

File:

PDF, 348 KB

english, 2008

38

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - System level thermal performance optimization of leaded packages for automotive applications

Chiriac, Victor Adrian

Year:

2008

Language:

english

File:

PDF, 621 KB

english, 2008

39

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 2 - A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Yu, Youmin, Chiriac, Victor Adrian, Lee, Tien-Yu Tom

Year:

2007

Language:

english

File:

PDF, 510 KB

english, 2007

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